The doi above is for this specific version of this dataset, which is currently the latest. Newer versions may be published in the future. For a link that will always point to the latest version, please use
doi: 10.4121/845aa72c-e96d-483f-888a-a23c173540b8

Martin, Henry Antony (2024): Data underlying the PhD dissertation 'Prognostics and Thermal Management of Power Electronic Packages'. Version 1. 4TU.ResearchData. dataset. https://doi.org/10.4121/845aa72c-e96d-483f-888a-a23c173540b8.v1

Dataset

• Electrical and Electronic Engineering
• Materials Engineering
• Engineering

condition monitoring, Integrated thermal management, Pb-free die-attach, thermal characterization, Thermal Test Chip

CC0

RefWorks, BibTeX, Reference Manager, Endnote, DataCite, NLM, DC, CFF

by Henry Antony Martin

The reliability of power electronic packages is often compromised by degradation mechanisms such as thermal fatigue and delamination, leading to economic consequences due to premature failures. Conventional approaches for reliability testing are inadequate for early fault detection. This research aims to develop a framework of prognostics based on online monitoring strategies for power electronic packages, with a particular focus on the die-attach interface material. The dataset provided in Chapters 2 and 3 is the lifetime reliability data of packages with different die-attach materials. The dataset provided in Chapter 5 is the thermal characterization data of different materials. The dataset provided in Chapter 7 is the device performance data with different thermal management strategies. To understand the data collection method and other calibration parameters, kindly refer to the dissertation document.

• 2024-10-31 first online, published, posted

4TU.ResearchData

*.xlsx, *.mat

TU Delft, Faculty of Electrical Engineering, Mathematics and Computer Science, Department of Microelectronics