# Input File for FEM Simulation with Mesh Ansys

## Mesh mesh_file <name.msh> <physical_entity_final_mesh_name>
#mesh_file C:/Archive/Programming/MATLAB/TOTEM_M/TECTO/TEC_Parameterized_NElem_Hex.inp Volume mm
#mesh_file C:/Archive/Programming/MATLAB/TOTEM_M/TECTO/TEC_Parameterized_NElem_Serendipity_Gmsh_10el.inp Volume mm
#mesh_file C:/Archive/Programming/MATLAB/TOTEM_M/TECTO/TEC_2401v3.inp Volume mm
mesh_file C:/Archive/Programming/MATLAB/TOTEM_M/TECTO/AnsysInp/mesh/1MC10_031_230116_Edge_075_Half.inp All m

rst_folder C:/Archive/Programming/MATLAB/TOTEM_M/TECTO/AnsysInp/OptResultsCte/
physics Thermoelectricity
solver NR
InitialTemperature 297
dimension 3D 

## Bi2Te3 Mechanical Properties: https://repository.bilkent.edu.tr/server/api/core/bitstreams/502cdf62-9b13-4faf-b245-8196af9e81ab/content
## Bi2Te3 Thermal Expansion: https://www.researchgate.net/publication/227109210_Thermal_expansion_of_bismuth_telluride
## Bi2Te3 Thermal Expansion: https://www.physics.purdue.edu/quantum/files/XChen_expansion_apl11.pdf
## Bi2Te3 Thermoelectric Properties: https://link.springer.com/article/10.1007/s11664-015-3898-y
## Copper Mechanical Properties: https://www.mit.edu/~6.777/matprops/copper.htm
## Solder Mechanical Properties: https://www.metallurgy.nist.gov/solder/clech/Sn-Ag-Cu_Other.htm#Young , https://www.jstage.jst.go.jp/article/matertrans/46/6/46_6_1271/_pdf , https://www.electronics-cooling.com/2006/08/thermal-conductivity-of-solders/
## Copper Electrical Properties: 
## Solder Electrical Properties: https://us.rs-online.com/m/d/8d9ef1f686bf70839a288bf4fd8e669e.pdf
## MATERIAL PROPERTIES: material <volumename> \n <propertyname> <value> \n ... 
##
material Body2 %SemiconductorN- 
Seebeck 0 0.0002171
Penalty_Seebeck 0 1
ThermalConductivity 0 1.054963
Penalty_ThermalConductivity 0 3
ElectricalConductivity 0 68829.898
Penalty_ElectricalConductivity 0 3
ThermalExpansionCoefficient_x 0 15E-6
ThermalExpansionCoefficient_y 0 15E-6
ThermalExpansionCoefficient_z 0 15E-6
YoungModulus 0 61.6E9
Penalty_YoungModulus 0 5
PoissonRatio 0 0.241

#L needs to be n- (negative seebeck) with positive deltaV
material Body4 %SemiconductorN- 
Seebeck 0 -0.000199
Penalty_Seebeck 0 1
ThermalConductivity 0 1.305023
Penalty_ThermalConductivity 0 3
ElectricalConductivity 0 76897.28
Penalty_ElectricalConductivity 0 3
ThermalExpansionCoefficient_x 0 15E-6
ThermalExpansionCoefficient_y 0 15E-6
ThermalExpansionCoefficient_z 0 15E-6
YoungModulus 0 61.6E9
Penalty_YoungModulus 0 5
PoissonRatio 0 0.241

## Cu
material Body1 %Copper
Seebeck 0 0
ThermalConductivity 0 385
ElectricalConductivity 0 59880239.52095808
ThermalExpansionCoefficient_x 0 17E-6
ThermalExpansionCoefficient_y 0 17E-6
ThermalExpansionCoefficient_z 0 17E-6
YoungModulus 0 130E9
PoissonRatio 0 0.34

material Body3 %Copper
Seebeck 0 0
ThermalConductivity 0 385
ElectricalConductivity 0 59880239.52095808
ThermalExpansionCoefficient_x 0 17E-6
ThermalExpansionCoefficient_y 0 17E-6
ThermalExpansionCoefficient_z 0 17E-6
YoungModulus 0 130E9
PoissonRatio 0 0.34

material Body5 %Copper
Seebeck 0 0
ThermalConductivity 0 385
ElectricalConductivity 0 59880239.52095808
ThermalExpansionCoefficient_x 0 17E-6
ThermalExpansionCoefficient_y 0 17E-6
ThermalExpansionCoefficient_z 0 17E-6
YoungModulus 0 130E9
PoissonRatio 0 0.34


## Boundary Conditions: bc <boundaryname> <surfacename> <value>
bc Voltage _CM77 0.0502758
bc Voltage _CM75 0.0
bc Temperature _CM81 298.15
bc heat_n HeatFlow 5333

## Topopoly Optimization Objective: TopOpt_Objective <ObjectiveName> <SurfaceName> <DesignElements>
TopOpt_Objective AverageTemperature TOBJ TOEL
Filter none

## Topopoly Optimization Extra Variable (bc): TopOpt_Variable <bctype> <SurfaceName> <minval> <initialval> <maxval> 
TopOpt_bc Voltage _CM77 0.01 0.01 0.06
## Topopoly Optimization Intial densities: TopOpt_Initial_x <value(0,1](if<0, random values )>
TopOpt_Initial_x TECTO/AnsysInp/scaling_kp_4_ap_1_gp_4.vtk

## Topopoly Optimization Constraints
TopOpt_Constraint Power 0.015
TopOpt_Constraint Volume 1
#TopOpt_Constraint Stress 20E6
#TopOpt_Constraint Stress_Pnorm 10E6
## Output Options
## output <data> <path/outputname>
##output T dataT.vtk