%0 Generic
%A Martin, Henry Antony
%D 2024
%T  Data underlying the PhD dissertation 'Prognostics and Thermal Management of Power Electronic Packages'
%U 
%R 10.4121/845aa72c-e96d-483f-888a-a23c173540b8.v1
%K condition monitoring
%K Pb-free die-attach
%K thermal characterization
%K Integrated thermal management
%K Thermal Test Chip
%X <p>The reliability of power electronic packages is often compromised by degradation mechanisms such as thermal fatigue and delamination, leading to economic consequences due to premature failures. Conventional approaches for reliability testing are inadequate for early fault detection. This research aims to develop a framework of prognostics based on online monitoring strategies for power electronic packages, with a particular focus on the die-attach interface material. The dataset provided in Chapters 2 and 3 is the lifetime reliability data of packages with different die-attach materials. The dataset provided in Chapter 5 is the thermal characterization data of different materials. The dataset provided in Chapter 7 is the device performance data with different thermal management strategies. To understand the data collection method and other calibration parameters, kindly refer to the dissertation document.</p>
%I 4TU.ResearchData