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Fatigue crack growth in FM94 epoxy adhesive bonds at different temperatures

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posted on 12.01.2017, 00:00 by M. (Muhammad) Usman
Data from fatigue crack growth tests on FM94 epoxy adhesive bonds at different temperatures. Mode I crack growth was measured using double cantilever beam specimens with Al-2024-T3 adherends. Tests were conducted at -55C, -20C, 0C, RT, 40C, 60C, and 80C

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Alderliesten, R.C. (René) [orcid:0000-0003-1882-5396]; Pascoe, J.A. (John-Alan) [orcid:0000-0003-2771-8285]; TU Delft, Faculty of Aerospace Engineering

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TU Delft

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Delft University of TechnologyDelft University of Technology

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Epoxy AdhesiveFM94Fatigue crack growthMode ITemperature effectmaster thesis

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